UV Curing for Photonic Integrated Circuit Packaging

Photonic Integrated Circuits use light to transmit and process data in optical networks, AI infrastructure, LiDAR, and sensing systems. Packaging often requires bonding fiber array units to chip edge couplers while preserving optical coupling performance.

PIC packaging is highly sensitive to alignment shift, adhesive shrinkage, and refractive index variation. A small change during curing can reduce coupling efficiency and lower production yield. Process validation is also important for foundry and OSAT production environments.

ETIA recommends OmniCure® LX500 for multi-channel precision UV LED spot curing and LS200 for in-situ dose measurement. For validated process environments, S2000 Elite with R2000 Radiometer can support documented curing control.

OmniCure® LX500 + LS200 is recommended for FAU-to-PIC bonding. S2000 Elite + R2000 can support documented process validation and qualification workflows.

As an authorized OmniCure® distributor, ETIA supports application review, product selection, genuine supply, installation, training, troubleshooting, and long-term service.

ETIA helps customers translate UV curing requirements into practical, reliable production solutions.