UV Curing for Co-Packaged Optics Fiber Array Bonding

Co-packaged optics integrates optical engines close to switch ASICs or AI accelerators. Fiber array bonding is a critical process because optical coupling efficiency depends on precise alignment between fiber arrays and silicon photonic interfaces.

CPO assembly requires extremely tight alignment stability. UV adhesive shrinkage, inconsistent dose, or uncontrolled curing can shift fiber position and reduce coupling efficiency. As CPO moves toward higher-volume manufacturing, process verification becomes increasingly important.

ETIA recommends OmniCure® LX500 with 365 nm UV LED heads for multi-channel precision curing, combined with LS200 for in-process UV dose verification. For qualification-level process control, S2000 Elite can support Closed-Loop Feedback curing. AC Small can support compact sealing steps where area exposure is needed.

OmniCure® LX500 + LS200 is recommended for CPO fiber array bonding. S2000 Elite supports qualification-grade stability, while AC Small can support package sealing applications.

As an authorized OmniCure® distributor, ETIA supports application review, product selection, genuine supply, installation, training, troubleshooting, and long-term service.

ETIA helps customers translate UV curing requirements into practical, reliable production solutions.