By Industry
Optical Modules
400G to 1.6T transceivers, co-packaged optics and fibre arrays ā sub-micron bonds that must not move.
The problem
UV curing in Optical Modules
In an optical transceiver, alignment is the product. A fibre array bonded a micron out of position costs insertion loss you can never recover, so the adhesive has to lock at the aligned position and stay there through reflow, thermal cycling and years in a hot switch cabinet.
That is a UV curing problem before it is an adhesive problem: cure too slowly and the alignment drifts; cure unevenly and shrinkage pulls the fibre off axis. ETIA specifies the spot head, wavelength and dose profile so the bond fixtures in the sub-second window your active alignment station allows.
Processes we solve
Fibre array & V-groove bonding
Sub-second tack at the aligned position, then full cure ā without pulling the fibre off axis.
Lens & isolator attach
Low-outgassing cures that keep the optical path clean over the module's service life.
Co-packaged optics assembly
Localised UV energy next to temperature-sensitive ASICs and photonic dies.
Connector termination
Fast, repeatable ferrule bonding for high-volume patch cord and connector production.
Fibre draw & recoat
High-intensity 360Ā° curing of primary and secondary coatings at draw-tower line speeds.
Recommended technologies
Application notes
All applications
Photonics & Advanced Packaging
UV Curing for Next-Generation Optical Transceiver Manufacturing (400Gā1.6T)
Precision UV curing for laser-to-fiber bonding, lens bonding, and optical alignment in 400G to 1.6T transceivers.
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Photonics & Advanced Packaging
UV Curing for Co-Packaged Optics Fiber Array Bonding
High-stability UV curing and dose verification for CPO fiber array bonding in AI data center infrastructure.
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Photonics & Advanced Packaging
UV Curing for Photonic Integrated Circuit Packaging
Controlled UV curing for FAU-to-PIC bonding, fiber-to-waveguide coupling, and silicon photonics packaging.
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Bring us the joint that won't hold.
Our engineers work the problem with you ā adhesive, geometry, dose and takt ā and specify the system that fits your line.