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15 of 15 application case studies
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Medical Device Assembly
UV Spot Curing for Cardiovascular Catheter Bonding
Controlled UV spot curing for balloon, hub, and marker bonding in cardiovascular catheter manufacturing.
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Medical Device Assembly
UV LED Curing for Hypodermic Needle & Cannula Assembly
High-speed UV LED curing for stainless steel cannula bonding and automated needle assembly.
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Medical Device Assembly
UV Curing for PCR and Microfluidic Diagnostic Card Sealing
Compact UV LED area curing for PCR cartridges, microfluidic channels, and IVD diagnostic card assembly.
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Automotive & ADAS
UV Curing for EV Battery Manufacturing
UV curing solutions for battery sealants, structural adhesives, and cell-to-pack protection.
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Automotive & ADAS
UV LED Curing for Automotive LiDAR Sensor Assembly
Precision UV curing for LiDAR optical alignment, MEMS mirror bonding, and environmental sealing.
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Automotive & ADAS
UV Spot Curing for ADAS Camera Module Assembly
Controlled UV curing for lens focus-lock bonding, optical filter bonding, and automotive camera sealing.
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Electronics & PCB Assembly
UV LED Curing for PCB Conformal Coating
Fast UV LED curing for PCB protection in electronics and automotive assembly.
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Electronics & PCB Assembly
UV LED Curing for Display Module OCA Bonding
Controlled low-heat UV LED curing for optically clear adhesive bonding in display module assembly.
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Electronics & PCB Assembly
UV LED Curing for OLED Panel Edge Sealing
Low-heat UV LED curing for moisture-sensitive OLED edge sealing and display encapsulation.
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Photonics & Advanced Packaging
UV Curing for Next-Generation Optical Transceiver Manufacturing (400G–1.6T)
Precision UV curing for laser-to-fiber bonding, lens bonding, and optical alignment in 400G to 1.6T transceivers.
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Photonics & Advanced Packaging
UV Curing for Co-Packaged Optics Fiber Array Bonding
High-stability UV curing and dose verification for CPO fiber array bonding in AI data center infrastructure.
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Photonics & Advanced Packaging
UV Curing for Photonic Integrated Circuit Packaging
Controlled UV curing for FAU-to-PIC bonding, fiber-to-waveguide coupling, and silicon photonics packaging.
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Photonics & Advanced Packaging
UV Curing for Advanced Semiconductor Packaging
UV curing solutions for chiplet bonding, underfill cure, photonic interconnect bonding, and UV dicing tape release.
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Fiber Optic & Cable Manufacturing
UV Spot Curing for Fiber Optic Connector Termination
Repeatable UV curing for ferrule bonding and low-loss optical connector assembly.
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Fiber Optic & Cable Manufacturing
UV LED Curing for Optical Fiber Draw Tower Coating
High-speed UV LED curing for primary and secondary optical fiber coatings in continuous draw tower production.
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UV Curing System Selection
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UV Lamp Spot Curing System
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